The high temperature adhesive market is anticipated to surpass USD 4.0 billion in 2024 and is likely to attain a valuation of USD 7.6 billion by 2034. The high temperature adhesive market size is projected to thrive at a CAGR of 6.7% from 2024 to 2034.
𝐈𝐧𝐝𝐮𝐬𝐭𝐫𝐲 𝐃𝐞𝐦𝐚𝐧𝐝:
The electronics industry’s constant evolution demands adhesive solutions that can withstand the high temperatures produced by modern electronics. High-temperature adhesives are essential to maintaining the dependability and durability of electronic goods, from producing semiconductors to assembling electronic components. Adhesives with greater heat resistance are in greater demand as consumer electronics become more potent and smaller. By forming strategic alliances with significant electronics suppliers and manufacturers, adhesive manufacturers that are positioned to provide innovative formulations meeting the changing demands of the electronics sector can benefit from this trend.
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The increasing use of microwave and high-frequency technology in communication devices has created an unusual demand for high-temperature adhesives for assembling high-frequency circuits. These adhesives make it possible to bind equipment parts such as high-frequency circuits, satellite communication systems, and radar systems.
High-temperature adhesives face new possibilities and shortcomings due to the growth of additive manufacturing and 3D printing. Adhesives that can adhere to and seal 3D-printed components are in greater demand as these technologies spread to the aerospace, automotive, and healthcare industries. This is especially true for components that can be exposed to high temperatures during the printing process or in the final application.
“Sustainability and the capacity to adjust to new technology are key factors influencing the continued expansion of the high temperature adhesive market. Personalization is still crucial, with businesses emphasizing customized solutions to satisfy various market needs. In this dynamic environment, creativity and compliance with laws are essential for success.” – says Nikhil Kaitwade, Associate Vice President at Future Market Insights, Inc.
𝐊𝐞𝐲 𝐓𝐚𝐤𝐞𝐚𝐰𝐚𝐲𝐬 𝐟𝐫𝐨𝐦 𝐭𝐡𝐞 𝐇𝐢𝐠𝐡 𝐓𝐞𝐦𝐩𝐞𝐫𝐚𝐭𝐮𝐫𝐞 𝐀𝐝𝐡𝐞𝐬𝐢𝐯𝐞 𝐌𝐚𝐫𝐤𝐞𝐭 𝐑𝐞𝐩𝐨𝐫𝐭:
- The global high temperature adhesive market size expanded at an 8.4% CAGR from 2019 to 2023.
- The epoxy segment is predicted to rise at a 6.5% CAGR through 2034.
- The electronic products segment is anticipated to develop at a 6.3% CAGR through 2034.
- The market size in the United States is projected to rise at a 7.0% CAGR through 2034.
- The market size in China is anticipated to develop at a 7.4% CAGR through 2034.
- The market size in Japan is estimated to surge at an 8.2% CAGR through 2034.
- The market size in South Korea is expected to increase at an 8.6% CAGR through 2034.
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𝐂𝐨𝐦𝐩𝐞𝐭𝐢𝐭𝐢𝐯𝐞 𝐋𝐚𝐧𝐝𝐬𝐜𝐚𝐩𝐞:
The high temperature adhesive market is intensely competitive, with global powerhouses such as Henkel, 3M, Dow, and Sika dominating. Niche players, such as Master Bond and LORD, carve out separate positions with specific formulas. Regional dynamics, particularly in Asia, with participants such as South Korean corporations, add to the competitive intensity. Chemical companies such as Huntsman and PPG provide diverse portfolios. Collaboration and sustainability are essential strategic themes, with businesses concentrating on agility and innovation to remain competitive in this changing environment.
𝐋𝐞𝐚𝐝𝐢𝐧𝐠 𝐊𝐞𝐲 𝐏𝐥𝐚𝐲𝐞𝐫𝐬 𝐢𝐧 𝐭𝐡𝐞 𝐇𝐢𝐠𝐡 𝐓𝐞𝐦𝐩𝐞𝐫𝐚𝐭𝐮𝐫𝐞 𝐀𝐝𝐡𝐞𝐬𝐢𝐯𝐞 𝐌𝐚𝐫𝐤𝐞𝐭:
- Henkel AG & Co. KGaA
- 3M Company
- Dow Inc.
- Sika AG
- Huntsman Corporation
- H.B. Fuller Company
- Master Bond Inc.
- LORD Corporation
- Permabond LLC
- PPG Industries, Inc.
𝐑𝐞𝐜𝐞𝐧𝐭 𝐃𝐞𝐯𝐞𝐥𝐨𝐩𝐦𝐞𝐧𝐭𝐬:
- In February 2024, Henkel launched two new medical-grade cyanoacrylate-based instant adhesives with improved safety and performance. The new products include no CMR (Carcinogenic, Mutagenic, or Reproductively Hazardous) substances and are designed to deliver increased strength during and after heat cycling.
- In September 2023, DELO introduced the first dual-curing, high-temperature glue for electric motor applications. DELO DUALBOND HT2990 is designed for a range of applications, including magnet bonding and stacking in electric motor manufacturing.
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𝐇𝐢𝐠𝐡 𝐓𝐞𝐦𝐩𝐞𝐫𝐚𝐭𝐮𝐫𝐞 𝐀𝐝𝐡𝐞𝐬𝐢𝐯𝐞 𝐌𝐚𝐫𝐤𝐞𝐭 𝐒𝐞𝐠𝐦𝐞𝐧𝐭𝐚𝐭𝐢𝐨𝐧:
By Type:
- Epoxy
- Silicone
- Polyurethane
- Acrylic
By Application:
- Electronic Products
- Automotive Industry
- Aerospace
- Ocean
- Building
- Other
By Region:
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia Pacific (APAC)
- Middle East & Africa (MEA)
- Japan
𝐀𝐛𝐨𝐮𝐭 𝐅𝐮𝐭𝐮𝐫𝐞 𝐌𝐚𝐫𝐤𝐞𝐭 𝐈𝐧𝐬𝐢𝐠𝐡𝐭𝐬 (𝐅𝐌𝐈)
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